Weekly News Bulletin Aug 28, 2026
Weekly Semiconductor Industry News Brief
① Jingsheng Mechanical & Electrical Releases H1 2026 Results: 8-inch SiC Substrate Capacity Ramps Up
On August 23, Jingsheng Mechanical & Electrical disclosed its H1 2026 semi-annual report, with operating revenue of RMB 3.452 billion and net cash flow from operating activities of RMB 1.366 billion, up 205.75% year on year. The company is actively advancing global capacity layout: 8-inch SiC substrates are now supplied at scale, 12-inch substrates in small-batch supply, and its 8-inch plant in Penang, Malaysia is expected to start production by the end of 2026. In diamond materials, the company has developed 8-inch polycrystalline diamond wafers and built a mass production line, fully mastering processes for the full 1-8 inch size range.
② Dinglong Reports H1 2026: CMP Pad Revenue RMB 745 Million, Up 56.83%
On the evening of August 25, Dinglong released its H1 2026 semi-annual report. Benefiting from the global semiconductor materials upturn, its semiconductor materials segment achieved main business revenue of RMB 1.262 billion, up 33.87% year on year, with the share of total revenue rising to 65.6%. CMP pad revenue reached RMB 745 million, up 56.83%, with monthly sales exceeding 50,000 pieces for the first time in June. CMP slurry and cleaning solution revenue reached RMB 193 million, up 63.02%, with new products such as large-wafer fine polishing slurry, ceria slurry and SiC substrate polishing slurry accelerating mass adoption.
③ Fureda H1 Net Profit Up 80.30%, Plans RMB 1.176 Billion Convertible Bond Issue for Expansion
On August 24, Fureda published its H1 2026 results, with operating revenue of RMB 1.586 billion, up 9.05% year on year, and net profit attributable to shareholders of RMB 207 million, up 80.30%. Driven by the dual engines of precision cleaning services for pan-semiconductor equipment and power semiconductor copper-clad ceramic substrates, the company's profitability improved significantly. The company also announced plans to issue convertible bonds of up to RMB 1.176 billion to fund seven projects including semiconductor cleaning and regeneration, precision component repair and ceramic package substrate expansion.
④ Xi'an Yicai H1 2026: Sales Volume 5 Million Wafers, Up 29.75%
On the evening of August 25, Xi'an Yicai released its H1 2026 semi-annual report. Against the backdrop of AI computing demand lifting the silicon material market, the company sold 5 million wafers in H1, up 29.75% year on year, with monthly sales exceeding 1 million pieces for the first time and production lines running at full utilization. Operating revenue reached RMB 1.589 billion, up 22.00%, and net loss attributable to shareholders narrowed by 14.98%. By the end of the reporting period, monthly capacity exceeded 1 million wafers, with a global market share of about 7.7%, ranking first in China in capacity.
⑤ Mitsubishi Chemical Enters Semiconductor Polishing Materials with 6N Ultra-Pure Colloidal Silica
Mitsubishi Chemical recently announced its entry into semiconductor CMP polishing materials. Its ultra-high-purity colloidal silica (ultra-pure silica sol) achieves a synthesis purity of 6N (99.9999%) and is the largest component by proportion in CMP slurries. It is widely used in critical processes including large-wafer fine polishing (eliminating subsurface damage), front-end-of-line (FEOL) and back-end-of-line (BEOL) polishing, and advanced packaging polishing. The global market has long been dominated by Japanese, European and American companies, while domestic material makers are accelerating their catch-up.
⑥ Sinomach Precision Industry H1 2026: Superhard Materials Gaining Rapid Traction in Semiconductor Applications
On August 27, Sinomach Precision Industry published its H1 2026 results. The rapid growth of its superhard materials business in semiconductor applications offset the decline in its bearing segment, resulting in a "revenue up, profit down" pattern: net profit fell due to a RMB 46.74 million increase in R&D expenses and lower investment income. Demand for superhard materials continues to expand in semiconductor processing steps such as wafer thinning, dicing and precision grinding and polishing.
⑦ Omdia Raises Global Wafer Fab Equipment Market Forecast
On August 27, research firm Omdia released its semiconductor equipment industry report, raising the 2026 global wafer fab equipment (WFE) market forecast to USD 161 billion and the 2027 forecast to USD 227 billion, representing year-on-year growth of 38% and 41%, respectively. The upgrade is driven by AI chip capacity expansion and HBM memory capital expenditure release. Advanced logic and 3D stacked memory are the main equipment purchasing drivers, with memory equipment growth expected to significantly exceed the industry average.
⑧ Infineon Plans Third Price Increase Notice This Year, Covering Some SiC Devices
According to channel and manufacturer information, Infineon plans to issue its third price increase notice of 2026 to customers by the end of August, with overall increases of 15%-20% covering AI data center power chips, automotive IGBT modules, medium and high-voltage MOSFETs and some SiC devices, applied in full to spot and non-long-term-agreement orders. As of August, lead times for mainstream automotive power devices have extended beyond 30 weeks, and over 40 weeks for SiC main drive modules, as the power semiconductor supply-demand gap continues to widen.
⑨ 8th Precision Ceramics and Power Semiconductor Industry Chain Exhibition Opens in Shenzhen
From August 26 to 28, the 8th Precision Ceramics and Power Semiconductor Industry Chain Exhibition 2026 was held at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall), alongside the 2026 Semiconductor Ceramics Industry Forum. The exhibition focuses on applications of precision ceramics in semiconductor equipment components and power device packaging. In recent years, domestic companies have continued to break through key technologies, with qualification and verification of local advanced ceramics components accelerating notably, and the localization of the industry chain continues to attract attention.
⑩ PCIM Asia 2026 Opens in Shenzhen, Focusing on Full Power Semiconductor Industry Chain
On August 26, PCIM Asia 2026 (Shenzhen International Power Components, Renewable Energy Management Exhibition and Seminar) opened at the Shenzhen World Exhibition & Convention Center, with an exhibition area of 30,000 square meters and 271 leading power electronics companies. It showcases power semiconductors, materials and packaging, passive components, power management, and testing and measurement, covering the complete industry chain from chip design and manufacturing packaging to system integration and end applications, targeting three application scenarios: e-mobility, AI data center power ecosystems, and renewable energy and smart energy.
Click for more details
① https://baijiahao.baidu.com/s?id=1874314583979139715
② https://www.stcn.com/article/detail/4126777.html
③ https://news.qq.com/rain/a/20260825A0637M00
④ https://www.sohu.com/a/1067420391_135869
⑤ https://www.abrasives.org.cn/news/47029.html
⑥ https://stock.10jqka.com.cn/20260828/c679388032.shtml
⑦ https://baijiahao.baidu.com/s?id=1874666212372070571
⑧ https://xueqiu.com/7459153692/405656284
⑨ https://www.zhanxun.cn/news/11136.html
⑩ https://www.e-fair.cn/news/detail?id=12079
