Weekly News Bulletin Sep 4, 2026
Weekly Semiconductor Industry News Brief
① Hua Hong Semi Plans USD 4.17 Billion Capital Increase for 12-inch Specialty Process Fab in Wuxi
On September 1, Hua Hong Semiconductor announced that the company and its wholly-owned subsidiary Shanghai Hua Hong Grace intend, together with other investors, to increase the capital of Wuxi Hua Hong Grace Phase III Semiconductor Co., Ltd. by USD 4.17 billion to build a 12-inch specialty process wafer foundry line with a monthly capacity of about 55,000 wafers. The matter was approved by the board of directors on September 1, 2026 and still requires approval at the shareholders' meeting.
② Foundry Momentum Continues: Mature-Node Capacity Tightens and Price-Hike Expectations Rise
Driven by AI demand, global foundry capacity utilization keeps climbing, and mature-node capacity has become structurally tight. SMIC's revenue in Q2 2026 exceeded USD 3 billion for the first time, while Hua Hong Semiconductor posted a record quarterly revenue, showing a clear picture of rising volume and price. According to market research reports, Hua Hong may raise wafer prices by about 10% in the second half of the year; domestic foundries remain generally cautious about price adjustments, but industry expectations of price hikes are gradually building.
③ Silicon Wafers See First Full-Size Price Increase in Over Three Years, Covering 6-inch to 12-inch Lines
Multiple media outlets recently reported that the semiconductor silicon wafer market is experiencing its first full-size price increase in more than three years, covering 6-inch, 8-inch and 12-inch product lines. In May, overseas leaders launched their second round of price increases of the year, mainly targeting 12-inch and high-end specialty wafers. Since August, domestic wafer makers have followed suit, with spot prices reacting first. Because leading fabs and wafer suppliers mostly sign long-term framework agreements, the revenue upside from price hikes is expected to materialize gradually as long-term contracts are renewed.
④ Xi'an Yicai and GRINM Silicon Hold H1 Results Briefings on the Same Day, Responding on Wafer Price Rises
On September 2, Xi'an Yicai and GRINM Silicon (Youyan Silicon) each held their H1 2026 results briefings, during which management exchanged views with investors on industry trends, silicon wafer price movements and future plans. Yang Xinyuan, chairman of Xi'an Yicai, noted at the briefing that the silicon wafer industry entered a downturn between 2022 and 2025, with prices falling by more than 30% from the highs; as the supply-demand structure improves, industry prosperity is gradually recovering, and the company will continue to ramp up capacity and upgrade its product mix.
⑤ SiEn Integration and Li Auto Sign New Strategic Cooperation as 8-inch SiC Wafers Roll Off the Line
On September 3, SiEn Integration (Xinlian Jicheng) and Li Auto announced a new round of in-depth strategic cooperation, jointly witnessing the successful rollout of 8-inch silicon carbide (SiC) wafers and signing a new strategic cooperation agreement. As the first domestic company to achieve mass production of 8-inch SiC wafers, SiEn Integration said the 8-inch SiC chips rolled off this time are about to enter the SOP mass-production stage, with the scope of cooperation extending from vehicle e-drive to new areas such as on-board thermal management systems.
⑥ Hunan San'an Semiconductor to Debut 8-inch and 12-inch SiC Optical Materials at CIOE
According to public reports, Hunan San'an Semiconductor, a subsidiary of San'an Optoelectronics, will debut its silicon carbide optical materials at the 27th China International Optoelectronic Exposition (CIOE) from September 9 to 11, focusing on 8-inch and 12-inch SiC optical substrates. The company's 12-inch SiC optical wafer pilot line has been successfully brought online, with products reaching an advanced industry level on key indicators such as absorptance, flatness (TTV/LTV) and surface roughness, laying the process foundation for subsequent mass production.
⑦ The 27th CIOE China to Be Held in Shenzhen from September 9-11
The 27th China International Optoelectronic Exposition (CIOE China) will be held from September 9 to 11, 2026 at the Shenzhen World Exhibition & Convention Center. This edition focuses on the deep integration of artificial intelligence and optoelectronic technology, covering the full optoelectronic industry chain spanning information and communication, optical components, lasers, infrared, sensing and semiconductors. Global optoelectronic companies will showcase their latest products and technologies, with multiple industry forums and exchange events held concurrently.
⑧ AI Compute Demand Shows Siphoning Effect, Automotive Chip Supply Remains Under Pressure
China Business Journal reported on September 3 that robust demand for compute chips from the AI industry is squeezing wafer capacity, keeping automotive-grade chip supply under pressure, with power devices, automotive MCUs and other products seeing longer delivery lead times and rising prices. Research institutions expect AI data-center-related semiconductor revenue to keep increasing as a share of the global semiconductor market, and automotive applications are facing knock-on effects from capacity reallocation.
⑨ "Self-Development + M&A" Dual Drive: Domestic Semiconductor Equipment Enters Phase 2.0
Shanghai Securities News reported on September 3 that, as domestic fabs accelerate capacity expansion and localization rates rise, China's semiconductor equipment industry is moving from "breakthroughs at point and line level" to "system capability building", with "self-development plus M&A" becoming the main path for leading companies to build platform-based capabilities. Growing global investment in AI infrastructure provides long-term demand support for semiconductor equipment and materials companies.
⑩ Memory Chip Prices Surge as Cost Pressure Passes Down the Supply Chain
From September 1, multiple mainstream smartphone makers raised prices on some models on sale amid sustained memory chip price increases. The latest round of memory price hikes stems from rapidly expanding demand for high-bandwidth memory (HBM) in AI servers, as advanced capacity shifts toward HBM and squeezes supply of consumer-grade DRAM and NAND, pushing prices significantly higher since the second half of 2025. Cost pressure is now being passed down the consumer electronics supply chain step by step.
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② https://baijiahao.baidu.com/s?id=1875360180060519043
③ https://news.qq.com/rain/a/20260831A06PWG00
④ https://baijiahao.baidu.com/s?id=1875272601715427110
⑤ https://finance.sina.com.cn/roll/2026-09-03/doc-iniqqnck4248302.shtml
⑥ https://caifuhao.eastmoney.com/news/20260902091516905594250
⑦ https://www.gkzhan.com/news/detail/195123.html
⑧ https://new.qq.com/rain/a/20260903A09UMU00
⑨ https://paper.cnstock.com/html/2026-09/03/content_2264932.htm
⑩ https://k.sina.com.cn/article_7880068406_1d5b04d3606801gwoe.html
