Focusing on the TGV Frontier | BOSI Kousei Seimitsu Cordially Invites You to the Suzhou Glass Substrate Industry Chain Summit Forum

Time: March 19-20, 2026

Venue: Suzhou Hotel Nikko

Organizer: Aibang

Event: The 3rd Glass Substrate TGV and Panel-Level Packaging Industry Chain Summit Forum

Nanjing BOSI Kousei Seimitsu Technology Co., Ltd. will present its core solutions at the exhibition. We welcome industry colleagues to visit our booth and discuss the future of technology together!

I. Company Introduction

Nanjing BOSI Kousei Seimitsu Technology Co., Ltd. was founded in July 2022, an innovative precision processing enterprise born amid the challenges of the pandemic.

Since its founding, we have upheld the spirit of "perseverance and enterprising progress," deeply cultivating the precision processing field, driven by technology, and building a comprehensive service system integrating trade, equipment sales, and technical services.

We focus on the lapping and polishing processing track, relying on high-precision equipment and high-quality consumables to provide professional support to customers in advanced manufacturing processes. We firmly believe that reasonable cost control and tailor-made technical solutions are the core of enhancing our customers' product competitiveness. We continuously explore new materials and new processes, creating tangible value for customers through professional services.

The company always adheres to the core philosophy of "people-oriented," regarding customer interests as its own responsibility, caring about employee well-being, and striving to build a warm and responsible corporate platform. At the same time, with a humble attitude and enthusiastic service spirit, we continuously optimize our after-sales response mechanism and build a robust and reliable quality assurance system, giving customers peace of mind.

Professionalism for excellence, integrity for success. BOSI Kousei Seimitsu will continue to deepen its technological barriers and enhance service depth, committed to becoming your trusted long-term partner in the precision manufacturing field.

II. Product Introduction

1. NORITAKE Grinding Wheels

With the development and application of semiconductor technology, the third-generation semiconductor material SiC is gradually taking the mainstream position. The introduction of this flat grinding wheel is an effective supplement to customer productivity.

NORITAKE grinding wheels provide reliable products across the entire SiC value chain, including substrates, epitaxy, devices, and advanced packaging. As an agent of NORITAKE, we closely follow customer needs and provide customized product supply with resin-bonded, metal-bonded, and ceramic-bonded options according to customers' different process requirements.

Rough Grinding Wheels:

Fine Grinding Wheels:

• Φ209 size grinding wheel

• Φ254 size grinding wheel

• Φ313 size grinding wheel

• Other specified sizes and shapes of grinding wheels can also be custom-made for you.

2. Polishing Pads

• Product: ATA880

  Material: Non-woven fabric

  Advantages: High removal rate, long lifespan

• Product: KS10

  Material: Backing pad

  Advantages: High surface quality

• Product: KS12

  Material: Polyurethane

  Advantages: High removal rate

• 3. Polishing Slurries

  Products: Silica, alumina, and diamond slurry

✅ Multiple particle sizes available: precisely matching the entire process from rough polishing to fine polishing, meeting the diverse needs of high-end manufacturing.

Forum Topics

We sincerely invite all industry elites to the venue to discuss the latest developments of glass substrates and TGV technology with BOSI Kousei Seimitsu, exchange industry experience, and share industrial resources!