Invitation | BOSI Kousei Seimitsu Invites You to the CSE Jiufengshan Forum to Explore the New Future of Precision Lapping and Polishing
Exhibition Name: 2026 China International Compound Semiconductor Industry Expo · Jiufengshan Forum
Exhibition Time: April 23 - April 25, 2026
Exhibition Venue: Wuhan · Optics Valley Science & Technology Convention & Exhibition Center · A123
Core Highlights:
1. Full-chain assembly of the compound semiconductor industry, with cutting-edge technologies launched collectively
2. Eight summit forums, industrial matchmaking conferences, and new product launch events held simultaneously
3. Focus on high-precision manufacturing fields such as semiconductors, optics, and special ceramics
01 Company Strategic Positioning
BOSI Kousei Seimitsu Technology Co., Ltd. is an enterprise focused on the lapping and polishing processing industry, integrating production, trade, equipment sales, and technical services. Relying on high-precision processing equipment and high-quality consumables, we provide solid technical support for customers' precision manufacturing needs.
With highly competitive product pricing, deeply adapted process solutions, and continuous R&D breakthroughs in new materials and new processes, we continuously create value for customers and help enhance their core product competitiveness.
02 Core Business System
(1) TORAY Polishing Pads
TORAY polishing pads excel in polymer chemistry and precision manufacturing technology, widely serving high-end industries such as semiconductors, automotive, and energy.
1. High process stability.
2. Excellent slurry retention and debris removal.
3. High polishing uniformity.
4. Long service life and low overall process cost.
Backing pad (KS09):
(2) BOSI Kousei Seimitsu Self-Developed Lapping and Polishing Slurries
The products focus on high-end fields such as semiconductor wafer manufacturing (silicon wafers, compound semiconductors), optical devices (lenses, optical glass), and precision component processing.
1. Self-manufactured, with stable and traceable quality.
2. Customized formulations offered to meet different material and process needs.
3. International first-class level with higher cost-performance.
Alumina (KSTP-IP80):
Two-component silica series (KSTP-LT80, KSTP-SP20):
Two-component silica series (KSTP-LT80, KSTP-SP20):
(3) NORITAKE Thinning (Back-Grinding) Wheels
NORITAKE is affiliated with the Morimura Group and was renamed from Nippon Toki to NORITAKE in 1904. Since its founding, it has continuously expanded into new business fields with ceramics at its core. Over its more than 100-year history, as the company's business has grown, NORITAKE has become the largest abrasive tool manufacturer in Japan, with a market share of over 40%. It provides products and technologies across a wide range of fields, from basic industries such as automotive and steel to electronic components and raw materials.
BOSI Kousei Seimitsu is the official national general agent for NORITAKE thinning wheels. The products focus on processing scenarios for materials such as silicon carbide, LT/LN, and silicon wafers, and can provide customized wheel products in three bonding systems—resin, metal, and ceramic—according to customer needs. Our wheels have the following specific advantages:
1. Low-load grinding. The porous structure of the wheel keeps particles at appropriate distances, delivering excellent cutting performance, strong grinding force, and good coolant penetration.
2. Long-life processing. The high-retention bonding agent prevents excessive shedding of abrasive grains and efficiently utilizes them, giving the wheels a longer lifespan.
3. Improved processing precision. NORITAKE's unique bonding agent patent ensures the necessary spacing between abrasive grains during grinding, achieving low-load, stable, and excellent grinding in the ultra-fine particle field.
4. Reduced processing cost. The extended service life further lowers processing costs.
Rough grinding wheels:
Fine grinding wheels:
03 Future Outlook
In the future, BOSI Kousei Seimitsu will deeply cultivate the lapping and polishing field and continuously strengthen the integrated service advantage of "equipment + consumables + process." We will increase R&D investment in new materials and new processes, driving the self-developed polishing slurries to achieve broader substitution and upgrading in high-end application scenarios such as semiconductors and optics. At the same time, leveraging the synergy of core products such as NORITAKE thinning wheels and TORAY polishing pads, we will build more competitive precision processing solutions. The company is committed to becoming a leading domestic and internationally renowned comprehensive lapping and polishing service provider, helping customers achieve efficient, stable, and low-cost high-precision manufacturing amid the wave of intelligent manufacturing.
About Us
Nanjing BOSI Kousei Seimitsu Technology Co., Ltd. was founded in July 2022, focusing on integrated cutting, grinding, and polishing solutions in the precision processing field. It is an enterprise integrating equipment agency, consumable R&D, process customization, and import/export services. The company focuses on the semiconductor, precision optics, and special ceramics industries, providing stable and reliable one-stop services for high-end manufacturing through high-precision lapping, polishing, and cutting products and technical support, helping customers improve quality and efficiency.
Positioning: Full-process equipment and consumable provision and process solution development for the lapping and polishing industry.
Company business: Precision processing consumables and equipment, self-developed product R&D, and technical solution services.
Main business:
① Supply of production consumables such as thinning wheels, lapping and polishing slurries, polishing pads, and ceramic balls.
② Improvement of existing process solutions and R&D of new solutions in the lapping and polishing industry.
Deep-cooperation partners: internationally renowned enterprises such as NORITAKE, TORAY, and Sumitomo Chemical.
