Invitation | BOSI Kousei Seimitsu Invites You to the Wuxi 2026 Semiconductor Packaging and Testing and Glass Substrate Ecosystem Exhibition
Invitation | BOSI Kousei Seimitsu Invites You to Wuxi · 2026 Semiconductor Packaging and Testing and Glass Substrate Ecosystem Exhibition
Exhibition Name: Semiconductor Packaging and Testing and Glass Substrate Ecosystem Exhibition
Exhibition Time: May 28 - May 29, 2026
Exhibition Venue: Wuxi · Wuxi International Convention Center
Core Highlights:
Highlight 1: Industry top-tier packaging and testing (OSAT) "benchmark event"
Highlight 2: Full-chain coverage, one-stop resource matching
Highlight 3: Hardcore technology, live CoWoS/TGV production lines
Highlight 4: AI computing frontier, focused on Chiplet/HBM
Highlight 5: Glass substrate ecosystem, the annual debut event
We sincerely invite you: Visit us at booth D19 to discuss new industry opportunities together!
01 Company Strategic Positioning
BOSI Kousei Seimitsu Technology Co., Ltd. is an enterprise focused on the lapping and polishing processing industry, integrating production, trade, equipment sales, and technical services. Relying on high-precision processing equipment and high-quality consumables, we provide solid technical support for customers' precision manufacturing needs.
With highly competitive product pricing, deeply adapted process solutions, and continuous R&D breakthroughs in new materials and new processes, we continuously create value for customers and help enhance their core product competitiveness.
02 Core Business System
1. TORAY Polishing Pads
TORAY polishing pads excel in polymer chemistry and precision manufacturing technology, widely serving high-end industries such as semiconductors, automotive, and energy.
(1) High process stability: Strong batch-to-batch consistency, ensuring continuous production on large production lines with stable and controllable yield.
(2) Excellent slurry retention and debris removal: Optimized abrasive distribution, effectively improving polishing operation efficiency.
(3) Excellent polishing uniformity: Improved edge effect, meeting the stringent process requirements of wafer planarization.
(4) Long service life and low overall process cost: Significantly enhanced product durability, effectively reducing CoO.
The following are some of our exhibits at this exhibition.
Large-size polyurethane polishing pad (KS01):
Multi-purpose black backing pad (KS17):
2. BOSI Kousei Seimitsu Self-Developed Lapping and Polishing Slurries
The products focus on high-end fields such as semiconductor wafer manufacturing (silicon wafers, compound semiconductors), optical devices (lenses, optical glass), and precision component processing.
(1) Self-manufactured, with stable and traceable quality: Strict quality control from the source, eliminating batch quality fluctuations.
(2) Customized formulations supported, adapting to different materials and processes: Abrasive particle sizes can be adjusted to optimal matching parameters based on the processing material and process needs.
(3) Performance reaching international first-class level with higher cost-performance: Product performance benchmarks international leading brands, and leveraging the local production cost advantage helps customers reduce costs and improve efficiency.
The following are some of our exhibits at this exhibition.
60-90nm silica lapping and polishing slurry (GC-80):
100-300nm cerium oxide polishing slurry (GC-200):
400-600nm cerium oxide polishing slurry (GC-500):
3. NORITAKE Thinning (Back-Grinding) Wheels
NORITAKE is a century-old comprehensive ceramics enterprise founded in 1904 in Nagoya, Japan. After more than a century of deep cultivation and development, it has become Japan's largest abrasive tool manufacturer, with a market share of over 40% in the domestic Japanese market.
NORITAKE wheels offer advantages such as low-load grinding, long service life, high processing precision, and low overall cost, adapting to the mainstream thinning equipment across the industry. They have already provided stable supply to multiple leading semiconductor device and substrate companies.
BOSI Kousei Seimitsu is the official national general agent for NORITAKE thinning wheels in China. The represented NORITAKE thinning wheel products focus on processing scenarios for precision materials such as silicon carbide, LT/LN, and silicon wafers, and can provide customized wheel solutions in three bonding systems—resin, metal, and ceramic—according to customer needs. Mainstream specifications such as Φ209, Φ254, and Φ313 are regularly stocked, and exclusive customization of various non-standard sizes and special shapes is also supported. The NORITAKE wheels we represent have the following advantages:
(1) Low-load grinding: The porous structure of the wheel keeps particles at appropriate distances, delivering excellent cutting performance, strong grinding force, and good coolant penetration.
(2) Long-life processing: The high-retention bonding agent prevents excessive shedding of abrasive grains and efficiently utilizes them, giving the wheels a longer lifespan.
(3) Improved processing precision: NORITAKE's unique bonding agent patent technology ensures reasonable spacing between abrasive grains during grinding, achieving low-load, stable, and excellent grinding in the ultra-fine particle field.
(4) Reduced processing cost: The extremely long service life further lowers processing costs.
The following are some of our exhibits at this exhibition.
Rough grinding wheels:
Fine grinding wheels:
03 Future Outlook
In the future, BOSI Kousei Seimitsu will deeply cultivate the lapping and polishing field and continuously strengthen the integrated service advantage of "equipment + consumables + process." We will increase R&D investment in new materials and new processes, driving the self-developed polishing slurries to achieve broader substitution and upgrading in high-end application scenarios such as semiconductors and optics. At the same time, leveraging the synergy of core products such as NORITAKE thinning wheels and TORAY polishing pads, we will build more competitive precision processing solutions. The company is committed to becoming a leading domestic and internationally renowned comprehensive lapping and polishing service provider, helping customers achieve efficient, stable, and low-cost high-precision manufacturing amid the wave of intelligent manufacturing.
About Us
Nanjing BOSI Kousei Seimitsu Technology Co., Ltd. was founded in July 2022, focusing on integrated cutting, grinding, and polishing solutions in the precision processing field. It is an enterprise integrating equipment agency, consumable R&D, process customization, and import/export services. The company focuses on the semiconductor, precision optics, and special ceramics industries, providing stable and reliable one-stop services for high-end manufacturing through high-precision lapping, polishing, and cutting products and technical support, helping customers improve quality and efficiency.
Positioning: Full-process equipment and consumable provision and process solution development for the lapping and polishing industry.
Company business: Precision processing consumables and equipment, self-developed product R&D, and technical solution services.
Main business:
① Supply of production consumables such as thinning wheels, lapping and polishing slurries, polishing pads, and ceramic balls.
② Improvement of existing process solutions and R&D of new solutions in the lapping and polishing industry.
Deep-cooperation partners: internationally renowned enterprises such as NORITAKE, TORAY, and Sumitomo Chemical.
