Weekly News Bulletin Dec 26, 2025

Weekly Semiconductor Industry News Brief

① Moore Threads Launches New-Generation GPU Architecture

On December 21, 2025, Moore Threads officially unveiled its new GPU architecture Huagang. It delivers a 50% boost in computing density and a 10-fold improvement in energy efficiency, supporting super-scale computing clusters with over 100,000 cards. The launch marks further progress for Moore Threads in AI and high-performance graphics rendering.

② UCloud and BYD Precision Establish Joint Laboratory

On December 22, UCloud announced it has signed a letter of intent with BYD Precision Manufacturing for comprehensive cooperation on immersion liquid-cooled servers. The two sides will build a joint laboratory to accelerate deployment of green and efficient computing infrastructure.

③ Yuexin Semiconductor Files Unprofitable IPO Application, Targeting Profit in 2029

Following Dapuwei’s upcoming hearing on ChiNext, Yuexin Semiconductor submitted an IPO application as an unprofitable enterprise. The case reactivates ChiNext’s listing standards for loss-making firms. Three semiconductor companies have been accepted by ChiNext this year, two of which are unprofitable.

④ Samsung Launches Exynos 2600, World’s First 2nm Smartphone Chip

On December 22, 2025, Samsung Electronics released Exynos 2600, the world’s first smartphone application processor manufactured on the 2nm process.

⑤ Hyperstrong Establishes Intelligent Manufacturing Company Covering IC Manufacturing Business

Beijing Hyperstrong Intelligent Manufacturing Technology Co., Ltd. was founded with registered capital of RMB 100 million. Its business scope includes intelligent manufacturing equipment, IC design and IC chip production.

⑥ Guanxiang Technology Plans Acquisition of Liaojing Electronics to Expand Smart Equipment Business

On the evening of December 21, 2025, Guanxiang Technology disclosed plans to acquire no less than 60% equity in Jinzhou Liaojing Electronics via share issuance together with supporting fundraising.

⑦ Storage Vendor Dapuwei to Face ChiNext Listing Review

Shenzhen Stock Exchange announced on December 18 that the ChiNext IPO hearing for Shenzhen Dapuwei Microelectronics will be held on December 25. Dapuwei will become the first unprofitable candidate under ChiNext’s relevant listing rules to attend the hearing.

⑧ Details of NVIDIA & Intel Serpent Lake Partnership Revealed

NVIDIA and Intel announced deep strategic cooperation in September 2025. The alliance includes joint technology development, and NVIDIA plans to invest USD 5 billion to purchase Intel common stock, demonstrating mutual confidence in long-term technological development.

⑨ NVIDIA Indicates H200 Chip Deliveries to Chinese Clients Before Chinese Lunar New Year

According to Reuters cited by Huanqiu.com on December 24, multiple insiders said NVIDIA has informed Chinese customers that it intends to deliver H200, its second-most powerful AI chip, by mid-February before the Lunar New Year.

⑩ Youyan Powder Materials: New Thermal Conductive Copper Powder Used for Huawei Ascend 910B Chip

Youyan Powder Materials stated during investor communication that its new thermal conductive copper powder, co-developed with Huawei, is applied to the Ascend 910B chip. Civil products currently account for a small share of its 3D printing powder sales, and the proportion will rise with growing demand for molds and prototypes. Youyan Additive Manufacturing maintains full order books and near-full capacity utilization.

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① https://www.dramx.com/News/IC/20251222-39659.html

② https://www.dramx.com/News/server/20251222-39662.html

③ https://www.dramx.com/News/made-sealing/20251222-39658.html

④ https://www.dramx.com/News/IC/20251223-39664.html

⑤ https://www.dramx.com/News/made-sealing/20251223-39668.html

⑥ https://www.dramx.com/News/made-sealing/20251222-39655.html

⑦ https://www.dramx.com/News/Memory/20251223-39670.html

⑧ https://www.dramx.com/News/AI/20251224-39676.html

⑨ https://www.dramx.com/News/AI/20251224-39675.html

⑩ https://www.dramx.com/News/cailiao-shebei/20251224-39674.html