Weekly News Bulletin Dec 19, 2025
Weekly Semiconductor Industry News Brief
① Qualcomm Announces Acquisition of Ventana to Deepen RISC-V Layout
On December 10 local time, Qualcomm announced the acquisition of Ventana Micro Systems Inc. to strengthen its RISC-V technology portfolio. Founded in 2018 and headquartered in Cupertino, Ventana focuses on high-performance, scalable and secure RISC-V compute chiplet solutions.
② Texas Instruments Establishes Strategic Cooperation with UBTECH
On December 14, 2025, Texas Instruments and UBTECH signed a strategic cooperation agreement. TI has purchased UBTECH’s industrial humanoid robot Walker S2, which is undergoing deployment and commissioning on production lines. The partnership marks important cross-industry collaboration between humanoid robotics and semiconductor manufacturing.
③ Japan to Build Advanced Semiconductor R&D Center, Targeting Operation in Fiscal 2029
On December 15, Japan’s Minister of Economy, Trade and Industry Ryoichi Akazawa announced that AIST (National Institute of Advanced Industrial Science and Technology) will build an open advanced semiconductor R&D center in Chitose, Hokkaido, scheduled to launch in fiscal 2029 (April 2029 – March 2030).
④ OmniVision Group Passes HKEX Listing Hearing
HKEX disclosure dated December 14 shows OmniVision Integrated Circuits Group has passed the hearing for main board listing. UBS, CICC, PASCHK and GFSHK act as joint sponsors.
⑤ EUR 1 Billion Investment: Pure Data Centres Plans One of Europe’s Largest Data Centers
Oak Capital-backed Pure Data Centres announced plans for a new data center campus in Amsterdam with investment up to EUR 1 billion (approximately USD 1.17 billion), one of the largest investment commitments for hyperscale data centers in Europe this year.
⑥ Biren Technology Plans Hong Kong IPO, Domestic GPU Accelerates Listing Process
CSRC International Department issued a filing notice for Shanghai Biren Technology’s overseas listing and full circulation of domestic unlisted shares. The company proposes to issue no more than 372,458,000 overseas-listed ordinary shares on HKEX. Its 57 shareholders plan to convert a total of 873,272,024 domestic shares for Hong Kong trading.
⑦ Powered by Innovation, Connecting Greater Bay Area — CITE 2026 Gears Up
At a press conference in Shenzhen on December 16, the organizing committee announced the 14th China Information Technology Expo (CITE 2026) will be held at Shenzhen Convention & Exhibition Center (Futian) from April 9 to 11, 2026.
⑧ AMD and Lenovo Deepen AI Cooperation
On December 16, AMD Chairwoman and CEO Lisa Su led an executive team to visit Lenovo Group’s global headquarters in Beijing, marking deeper collaboration between the two parties in artificial intelligence.
⑨ Jingjia Micro’s Self-Developed High-Compute Edge AI SoC Successfully Powered On
On the evening of December 15, Jingjia Micro announced its holding subsidiary Chengheng Microelectronics achieved successful power-on of its self-developed high-computing edge AI SoC chip. The milestone extends Jingjia Micro’s high-performance chip capacity to general-purpose AI hardware.
⑩ New 3D Chip Delivers Nearly an Order-of-Magnitude Performance Boost Over 2D Chips
Engineers from Stanford, Carnegie Mellon, University of Pennsylvania, MIT collaborated with SkyWater Technology to develop a novel monolithic multi-layer 3D computing chip, representing a major breakthrough in AI hardware. The research was presented at the 71st IEEE International Electron Devices Meeting (IEDM 2025).
Click for more details
