Weekly News Bulletin Nov 28, 2025

Weekly Semiconductor Industry News Brief

① Elon Musk Announces Tesla AI5 Chip Design Nearly Completed, R&D of AI6 Initiated

Tesla CEO Elon Musk posted on X that the tape-out of self-developed AI5 chip is approaching, while R&D for next-generation AI6 chip has started. Having passed design review, AI5 delivers computing power of 2,000–2,500 TOPS, five times that of AI4. It supports complex unsupervised autonomous driving algorithms with around 50-fold higher inference performance.

② KZFC Ships First Wafer Flatness Measurement Equipment to HBM Customer

KZFC delivered its first GINKGOIFM-P300 wafer flatness metrology tool to an HBM client. The product marks a major domestic breakthrough, breaking long-term overseas monopoly. It enables measurement of highly warped and low-reflectivity wafers, and supports full-parameter inspection of bonded wafers and compound semiconductor substrates including SiC and GaAs.

③ CXMT Launches New DDR5 Memory Products with Peak Speed of 8000Mbps

On November 23, CXMT released its new DDR5 product lineup with a maximum data rate of 8000Mbps and maximum die capacity of 24Gb. Seven module variants for servers, workstations and PCs were rolled out simultaneously.

④ RMB 1 Billion Yaxin Micro Packaging & Testing Project Enters Final Construction Phase

As a key introduced project in Yiwu, Yaxin Micro’s chip packaging and testing base focuses on power devices, CPUs and other core components. Its construction has entered the sprint stage.

⑤ Super Storage Cycle Arrives; Derui Lingxin Leverages PCIe 5.0 for AI Storage Track

Driven by booming AI large models and intelligent computing industry, storage, the fundamental enabler of computing power, is undergoing dual transformation in technological innovation and scenario adaptation.

⑥ MIIT to Boost High-Quality IC Industry Development in Three Key Directions

IC China 2025 kicked off on November 23 at China National Convention Center, Beijing. Gao Dongsheng, Chief Economist of MIIT, stated that integrated circuits constitute a strategic, fundamental and pioneering industry underpinning economic and social development.

⑦ Nano Functional Material Project for High-End IC and Electronic Components Settles in Dalian

On November 21, Jinpu New Area of Dalian signed an investment agreement with Shanghai Huajujin New Materials for a project specializing in nano functional materials for high-end integrated circuits and electronic components.

⑧ Chinese AI & Robot Enterprises Gather in Hong Kong for Global Expansion

GIS Global Innovation Expo & Summit (Hong Kong) will run on December 2–3 at AsiaWorld-Expo. Centered on the theme “Connect Global Minds, Innovate Green Future”, the event serves as a launch hub for Chinese tech firms going global to showcase domestic technological advances and facilitate worldwide industrial collaboration.

⑨ ICCAD-Expo 2025 Successfully Concluded

Held November 20–21 at Western China International Expo City, Chengdu, ICCAD-Expo 2025 brought together industry participants to exchange insights on integrated circuit development in Chengdu-Chongqing region.

⑩ Japan’s Rapidus Targets 1.4nm Chip Production in 2029

Japanese chipmaker Rapidus plans to build its second wafer fab in Hokkaido in fiscal 2027, aiming to start manufacturing advanced 1.4nm chips as early as 2029. The initiative intends to narrow the gap with leading foundries such as TSMC and rebuild Japan’s strategic independence in advanced semiconductors.

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