Weekly News Bulletin Nov 21, 2025
Weekly Semiconductor Industry News Brief
① United Nova Launches Brand-New SiC G2.0 Technology Platform
On November 16, United Nova officially unveiled its new SiC G2.0 technology platform adopting advanced 8-inch manufacturing technology reaching world-leading standards.
② GaNNext Officially Launches Gen3 Platform
Zhuhai GaNNext Technology released its 650/700V FET products based on Gen3 technology platform for mass market rollout.
③ Samsung Group Plans KRW 450 Trillion Domestic Investment in South Korea Over Five Years
Samsung Group announced plans to invest a total of KRW 450 trillion (around USD 310 billion) in South Korea within five years including R&D. It will expand semiconductor investment; the 5th new production line at Pyeongtaek Plant 2 is scheduled for full operation in 2028. With the acquisition of PlactGroup in early November, Samsung Electronics plans to build a domestic production line targeting AI data center market.
④ Rising Memory Prices Pressure Consumer Market; 2026 Smartphone & Notebook Shipment Forecasts Downgraded
TrendForce research indicates persistent uncertainties for 2026 consumer market. Inflation and upward memory prices lift device costs and terminal prices, suppressing consumer demand.
⑤ Two Days to Go | Theme & Data of Professor Wei Shaojun’s Keynote Released
ICCAD-Expo 2025 (31st IC Design Industry Exhibition) will be held at Western China International Expo City, Chengdu during November 20–21, 2025.
⑥ Arm Cooperates with NVIDIA to Boost Custom Chip Integration
On November 17, Arm announced Neoverse CPUs based on Arm architecture can achieve high-efficiency integration with AI accelerators via NVIDIA’s NVLink Fusion technology.
⑦ TSMC CoWoS No Longer the Only Option? Apple and Qualcomm Consider Intel Advanced Packaging
Soaring demand for advanced packaging creates tight CoWoS capacity. Media reports show Apple and Qualcomm list experience with Intel EMIB and Foveros technologies in job openings, revealing major clients are seeking alternatives amid AI/HPC capacity constraints.
⑧ G.SKILL Sets New DDR5 Overclock World Record at DDR5-13322 by German Overclocker CENS
On November 18, G.SKILL announced a new DDR5 overclock world record. Extreme overclocking expert CENS successfully pushed memory frequency to DDR5-13322.
⑨ GlobalFoundries to Acquire Singapore Silicon Photonics Foundry
GlobalFoundries announced acquisition of Singapore-based silicon photonics foundry Advanced Micro Foundry (AMF). Upon completion, GlobalFoundries will become the world’s largest silicon photonics foundry by revenue. Financial terms remain undisclosed.
⑩ Sino-Microelectronics Plans Investment Up to RMB 60 Million for Partial Stake in Xindonglai
On the evening of November 18, Sino-Microelectronics announced the planned acquisition of partial equity in Xindonglai with a maximum consideration of RMB 60 million. Xindonglai’s valuation is capped at RMB 520 million. The transaction constitutes a connected transaction instead of major asset restructuring.
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① https://www.dramx.com/News/made-sealing/20251117-39430.html
② https://www.dramx.com/News/cailiao-shebei/20251117-39431.html
③ https://www.dramx.com/News/made-sealing/20251117-39433.html
④ https://www.dramx.com/Market/20251117-39436.html
⑤ https://www.dramx.com/News/IC/20251118-39437.html
⑥ https://www.dramx.com/News/IC/20251118-39438.html
⑦ https://www.dramx.com/News/made-sealing/20251118-39446.html
⑧ https://www.dramx.com/News/Memory/20251118-39447.html
⑨ https://www.dramx.com/News/made-sealing/20251119-39448.html
⑩ https://www.dramx.com/News/cailiao-shebei/20251119-39454.html
