Weekly News Bulletin Aug 01, 2025

① Jingmei Photomask’s High-End Photomask Project Settles in HefeiRecently, Jingmei Photomask’s high-end photomask project with a planned total investment of RMB 120 billion officially settled in Hefei High-Tech Zone. The project focuses on the R&D, production and sales of semiconductor photomasks for 28nm and above nodes. Phase I requires an investment of RMB 6.5 billion, with a monthly capacity of approximately 3,200 pieces upon full production.

② RMB 1 Billion Chip Packaging Project Lands in TaizhouA project signing ceremony was held in Jiangyan High-Tech Zone, Taizhou. Two projects successfully signed on-site: Chengdu Xinmengwei Semiconductor chip packaging project with total investment of RMB 1 billion, and semiconductor vacuum pump & components project worth RMB 500 million, injecting strong momentum into local semiconductor industry development.

③ Shanghai Simgui’s Shareholder Xinguang Group Invests RMB 10 Billion in Chongqing Wanguo to Deploy AIDC Power DevicesOn July 25, a seminar on power device applications for AI infrastructure themed "New AI Era, Energy Efficiency Drives Future" was held in Chongqing. Attending experts believed that rapid evolution of AI era is driving power solutions for AI Data Centers (AIDC) toward new architectures with high power and high density.

④ Lisuan Technology Unveils Its First Fully Self-Developed GPU: Outperforms RTX 4060, Closing in on RTX 5060On July 26, domestic GPU developer Lisuan Technology held a product launch and officially rolled out its first fully in-house developed GPU chip series 7G100 and Lisuan eXtreme graphics cards. Adopting a 6nm process after four years of R&D, this graphics processor marks a breakthrough for China’s high-end graphics GPU sector from "following" to "running neck-and-neck".

⑤ Enflame Launches New-Gen AI Chip Enflame L600, Setting New Benchmark for Domestic Computing PowerAt the World Artificial Intelligence Conference on July 27, domestic AI chip maker Enflame officially released its latest all-in-one training-and-inference AI chip Enflame L600. The chip represents a major breakthrough for China in AI chips and signals a new stage for domestic computing technology.

⑥ Tianyue Advanced & Guangzhou Yuesheng Release Latest SiC ProgressAccording to Tianyue Advanced’s official WeChat account on July 29, the company has begun bulk supply of silicon carbide substrates to the Japanese market. Its overseas revenue reached RMB 840 million in 2024, a year-on-year increase of 104.43%, accounting for 47.53% of total revenue. The firm expects this proportion to rise further in the future.

⑦ Guangzhou Yuesheng Completes R&D and Shipment of 8-inch SiC Epitaxial EquipmentThe self-developed 8-inch silicon carbide (SiC) epitaxial equipment has finished R&D and been successfully delivered to benchmark customers.

⑧ Another SiC Fab Completed with USD 1.27 Billion InvestmentVietnam+ foreign media reported that on July 28, U.S. leading SiC substrate manufacturer Coherent inaugurated its SiC factory in Vietnam. Built at a cost of USD 1.27 billion (around RMB 9.12 billion), the plant will produce silicon carbide semiconductors, optical glass and advanced optical components.

⑨ U.S. to Roll Out Semiconductor Tariffs Ranging from 25% to 100%The U.S. is considering imposing additional tariffs on imported semiconductors, with investigation results to be announced within two weeks. On local time July 27, U.S. Commerce Secretary Howard Lutnick stated that the Trump administration will release national security investigation findings on semiconductor imports in two weeks.

⑩ Innoscience and UAES Establish Joint GaN Technology LaboratoryOn July 30, Innoscience announced the launch of a joint laboratory with United Automotive Electronic Systems (UAES). Leveraging GaN technology’s advantages in size, weight and efficiency, both parties will develop advanced power electronic systems for new energy vehicles. The unveiling ceremony was held at UAES Suzhou R&D Center.

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