Weekly News Bulletin July 25, 2025
Weekly Semiconductor Industry News Brief
① Sandisk Scraps$50 Billion Michigan Wafer Fab PlanSandisk announced it will abandon plans to build a semiconductor manufacturing facility worth more than $50 billion in Michigan, U.S.A. According to Associated Press and local outlet Crain's Detroit Business, Michigan Governor Gretchen Whitmer stated on Wednesday that the project was suspended due to "significant national-level economic uncertainty". The firm has no intention of relocating the project to other parts of the United States.
② Zhanchip Electronics and Zhongdao Optoelectronics Enter Strategic Cooperation to Accelerate Domestic Substitution in SemiconductorsZhongdao Optoelectronics Equipment Co., Ltd. and Zhejiang Zhanchip Electronics Technology Co., Ltd. recently formally established a strategic partnership. Both parties aim to jointly boost process yields in SiC power chip manufacturing and advance domestic substitution of core inspection equipment.
③ Japanese Chipmaker Rapidus Launches 2nm Trial ProductionOn July 18, Japanese semiconductor firm Rapidus announced the official launch of trial manufacturing for 2nm GAA (Gate-All-Around) transistors and unveiled its first 2nm GAA wafer. The milestone marks a crucial advance for Japan in advanced process technology and lays groundwork for future mass production of 2nm chips.
④ Samsung Hits Over 50% DRAM Yield; HBM4 Mass Production Scheduled for H2South Korean media reported on July 18, 2025 that Samsung Electronics achieved major progress on its 10nm-class 1c-generation DRAM process, with yields exceeding 50%. The improvement is expected to strengthen Samsung’s competitiveness in high-performance memory. The company plans to kick off mass production of 6th-generation High Bandwidth Memory (HBM4) in the second half of the year.
⑤ Jingsheng Mechanical’s Supporting Crystal Project for 600,000 8-inch SiC Wafers Breaks GroundOn July 20, the groundbreaking ceremony was held for a supporting crystal project of Ningxia Chuangsheng New Materials Technology Co., Ltd., a subsidiary of Jingsheng Mechanical & Electrical Co., Ltd. The project targets an annual output of 600,000 pieces of 8-inch silicon carbide substrates.
⑥ Samsung to Ship HBM4 Samples, Challenging SK Hynix’s HBM DominanceNews dated July 21 states Samsung plans to deliver HBM4 samples to clients including AMD and NVIDIA by the end of this month, seeking to challenge SK Hynix’s leading position in the HBM market.
⑦ Xinde Semiconductor Secures Nearly RMB 400 Million Financing for Mid-to-High-End Packaging & TestingAs of July 22, Jiangsu Xinde Semiconductor Technology Co., Ltd. completed a new round of financing. The financing was jointly led by municipal and district investment institutions, with participation from Oriza Prosperity Capital, Jiangsu Strategic Emerging Industry Fund and Yushan Capital.
⑧ RMB 4.5 Billion Project: Xinyeshidai’s 8-inch Wafer Fab Targets Trial Production in SeptemberAs reported by Shaanxi News Network, the 8-inch high-performance specialty process IC production line of Shaanxi Electronics Xinyeshidai has entered the final phase before power-on, with trial production scheduled for September.
⑨ onsemi Partners with Stony Brook UniversityForeign media recently reported that onsemi has sealed a cooperation agreement with Stony Brook University in New York, U.S. The two sides plan to build a state-of-the-art semiconductor materials research center worth USD 20 million on the university’s campus.
⑩ Kema Technology Proposes Acquisition of 73% Stake in Suzhou Kaixin SemiconductorOn July 22, Suzhou Kema Materials Technology Co., Ltd. issued an announcement proposing to acquire a 73.00% equity interest in Suzhou Kaixin Semiconductor Technology Co., Ltd. for cash consideration of RMB 102.3702 million.
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④ https://www.dramx.com/News/Memory/20250721-38833.html
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