Weekly News Bulletin Sep 11, 2026
Weekly Semiconductor Industry News Brief
① The 27th CIOE China Opens in Shenzhen, with AI and Localization as Two Main Themes
On September 9, the 27th China International Optoelectronic Exposition (CIOE 2026) opened at the Shenzhen World Exhibition & Convention Center (Bao'an), running from September 9 to 11. The exhibition covers 260,000 square meters and brings together more than 4,000 exhibitors across the full optoelectronic industry chain, including information and communication, optics, lasers, infrared, sensing and new displays. On the show floor, artificial intelligence and localization emerged as the two main themes, with optical module, optical chip and related manufacturing equipment companies showcasing their latest products and solutions. Concurrent events such as the IEEE Global Optoelectronics Conference focused on frontier industry directions.
② SICC: SiC Substrate Prices Basically Stabilized Since Early 2026, 8-inch Capacity Utilization Continues to Ramp Up
On September 11, SICC (Tianyue Advanced) held its H1 2026 results briefing. Chairman and general manager Zong Yanmin said the SiC substrate industry is gradually moving from a phase of rapid price adjustment to a new stage of "price stabilization and demand expansion"; based on the company's own experience, product prices have basically stabilized since the beginning of the year and the supply-demand structure is continuously improving. The company's SiC substrate sales volume has grown significantly, utilization of its 8-inch production line keeps ramping up, and the company will continue to pace capacity expansion based on orders while improving line yields to dilute unit depreciation costs.
③ San'an Optoelectronics: 8-inch SiC Substrates in Small-Batch Shipment, 12-inch Products Under Customer Verification
On September 11, San'an Optoelectronics responded to questions on its SiC business on the investor interaction platform. The company said it has established upstream operations covering SiC substrates and SiC epitaxy, with 8-inch SiC products already in small-batch shipment and 12-inch products under verification at leading industry customers. The company also noted that SiC costs are mainly raw material costs, and that rising raw material prices have essentially no impact on the company. In terms of capacity, Hunan San'an currently has 6-inch SiC substrate capacity of 16,000 pieces per month, 8-inch substrate capacity of 1,000 pieces per month, and SiC epitaxy capacity of 2,000 pieces per month.
④ STAR Market Collective Results Briefing Held for Semiconductor Manufacturing, Equipment and Materials
On September 10, the Shanghai Stock Exchange hosted the 2026 H1 collective results briefing for STAR Market companies in the semiconductor manufacturing, equipment and materials sector. Twenty-one core companies across the semiconductor equipment, materials, manufacturing and packaging & testing chain attended, including AMEC, Huafeng Test & Control, Nexchip, Zhenbao Technology and Jiuri New Materials. Signals from the meeting indicate that the equipment segment, benefiting from domestic fab capacity ramp-up and verification breakthroughs, has entered a phase of large-scale order delivery, while the materials segment is keeping pace with capacity expansion and achieving breakthroughs in high-end categories, strengthening supply chain coordination.
⑤ Institution: Localization of Advanced Ceramic Components Shifts from Technical Breakthrough to Volume Ramp-Up
On September 11, GF Securities released a research report noting that advanced ceramic components are core consumables and key structural parts of front-end semiconductor equipment. Advanced ceramic materials such as alumina, aluminum nitride, silicon carbide and silicon nitride, with their high hardness, corrosion resistance and high-temperature resistance, are widely used in critical positions of equipment for etching and thin-film deposition. The global market for this field has long been oligopolistic; as domestic fab expansion and supply chain security needs converge, localization by domestic ceramic component makers is moving from technical breakthroughs into volume ramp-up, and core links of the supply chain continue to draw market attention.
⑥ ChangXin Memory Technologies Posts 82% EBIT Margin in Q2, Highest Among Global Memory Makers
On September 11, Nikkei Asia reported, citing FactSet data, that ChangXin Memory Technologies (CXMT) achieved an EBIT margin of 82% in the second quarter of 2026, exceeding SK hynix's 76% and the 70% of Samsung Electronics' semiconductor business, making it the most profitable memory chip maker globally in the quarter, with revenue growing sharply year on year. The report attributes the profit improvement mainly to an upcycle in the DRAM industry: AI-driven memory demand growth has led major manufacturers to shift substantial capacity to higher-value HBM products, tightening supply of conventional DRAM and pushing prices higher.
⑦ Diamond Heat-Spreading Materials Emerge as Key Upgrade Path for AI Chip Packaging Thermal Management
On September 10, 21st Century Business Herald reported that diamond heat-spreading materials are becoming a key upgrade direction for AI chip packaging thermal management, with the related industry at an inflection point of moving from zero to one in industrialization and featuring high technical barriers. As AI models continue to iterate and computing server power consumption keeps rising, traditional copper and silicon-based heat dissipation materials are approaching their physical performance limits, and ultra-high thermal conductivity materials represented by CVD synthetic diamond are accelerating into the semiconductor thermal management field. Business growth in the semiconductor direction for superhard materials companies has drawn attention.
⑧ TSMC Continues to Raise 2026 Equipment Procurement Expectations, Equipment and Core Components Take Up the Momentum
On September 11, institutional research showed that TSMC continues to raise its 2026 equipment procurement expectations: using its end-2025 estimate of 2026 equipment procurement volume as a baseline of 1X, the figure was raised to 1.5X in Q1 2026 and further to 1.9X in July. Global advanced-node capacity expansion is accelerating, while domestic memory and advanced packaging capacity construction advances in parallel. Equipment and core components are becoming new focal points of the semiconductor supply chain, and institutions believe momentum in these segments is likely to continue.
⑨ DRAM and NAND Prices Keep Rising, Supply Chain Watches the Cycle's Pace
On September 11, media reports noted that the current rise in DRAM and NAND prices has lasted about a year, with notable increases in major products, sharply improved profitability for upstream memory makers, and widespread downstream attention to the sustainability and pace of price increases. Industry analysis suggests that AI server demand driving higher-value-added memory products, along with advanced capacity being allocated to products such as HBM, are important factors behind the price uptrend, while future supply-demand changes remain a market focus.
⑩ Enflame Technology Lists on the STAR Market on September 11
Domestic AI computing chip company Enflame Technology listed on the Science and Technology Innovation Board (STAR Market) of the Shanghai Stock Exchange on September 11, according to disclosures. The company's earlier listing announcement stated that its shares would begin trading on September 11. As demand for artificial intelligence computing continues to grow, domestic AI chip companies are accelerating their access to capital markets, drawing industry attention to supply chain coordination and industrialization progress.
Click for more details
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