Weekly News Bulletin Dec 05, 2025

Weekly Semiconductor Industry News Brief

① Micron Plans USD 9.6 Billion Investment for New Memory Chip Fab in Japan

Micron Technology announced investment of JPY 1.5 trillion (approximately USD 9.6 billion) to build a new HBM manufacturing plant at its existing site in Hiroshima. Construction is scheduled to kick off in May 2026, with HBM shipments expected to commence around 2028.

② Sunking Nano Invests RMB 500 Million to Accelerate Qingdao Semiconductor Testing Project

On the evening of November 28, Sunking Nano disclosed its wholly-owned subsidiary will invest roughly RMB 500 million in the Qingdao testing and analysis capacity expansion project to optimize national layout and strengthen competitiveness in third-party semiconductor testing.

③ Qingyi Optoelectronics: Foshan Nanhai Base Operational; High-Precision Display Photomask Project Nears Mass Production

Qingyi Optoelectronics stated on investor platform that its Foshan Nanhai facility held an opening ceremony on November 14, 2025. The high-precision display photomask project is approaching mass production, while preparations for high-end semiconductor photomask manufacturing are well underway.

④ Rianlon Takes Stake in Sidofu to Expand Electronic New Materials Layout

On November 27, Rianlon announced a RMB 50 million strategic investment in Shenzhen Sidofu New Materials. Together with a RMB 10 million investment from Tianjin fund, Rianlon will hold 25% equity and Sidofu will maintain independent operation. Post-money valuation stands at RMB 200 million.

⑤ Qingdao IC Industry-Education Alliance Officially Launched in Qingdao Pilot Free Trade Zone

A promotion meeting was held on November 28 in the free trade zone. The alliance established its council and inaugurated one main plus three branch training bases, marking formal physical operation.

⑥ IIC Shenzhen 2025 Successfully Concluded; Global Electronic Components Distributor Excellence Awards Unveiled

The two-day International IC Exhibition & Conference wrapped up on November 26 in Shenzhen. The event gathered global exhibitors and high-end forums to boost international cooperation and innovation across the semiconductor sector.

⑦ Tightening NAND Flash Wafer Supply; Some Contract Prices Surge Over 60% in November | TrendForce

Per TrendForce, AI workloads and enterprise SSD orders sustained strong NAND demand in November. Manufacturers prioritize high-margin premium and enterprise products while phasing out old-capacity lines. Wafer shortages drove broad price hikes of 20%–60% across capacities.

⑧ AWS Unveils Trainium3 AI Chip

At AWS re:Invent on December 2, AWS launched Trainium3, its first 3nm AI chip designed for training and serving next-gen generative AI, inference, multi-modal and video generation applications.

⑨ Samsung Completes Development of 6th-Gen HBM4, Targeting Mass Production by End of 2025

Samsung Electronics finished development of its 6th-generation HBM4 and moves forward with mass production preparation. Prototype samples are delivered to NVIDIA for qualification testing, marking a milestone in high-performance memory technology.

⑩ Surging Memory Prices Hit Game Console Profit Margins; 2026 Shipment Forecast Revised Downward | TrendForce

Sharp memory price increases push up hardware costs and terminal prices, weighing on consumer demand. Following downgrades for smartphones and notebooks, TrendForce cut the 2026 game console shipment forecast from a 3.5% annual decline to a 4.4% drop.

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