Weekly News Bulletin Oct 24, 2025

Weekly Semiconductor Industry News Brief

① Connecting Main Logistics for 12-inch Wafers: SZN Wins Outstanding Enterprise Award at Bay Semiconductor Expo

The 2025 Bay Area Semiconductor Industry Eco Expo was held at Shenzhen Convention & Exhibition Center from October 15 to 17. Suzhou SZN Semiconductor Equipment showcased its self-developed AMHS overhead hoist transport system and demonstrated real-time operation of OHT on site.

② China’s First Fully Automatic 8-inch MEMS Wafer Production Line Goes Online

CEFOC announced the first batch of products rolled off the production line for the EPC project of the 8-inch MEMS wafer fab in Bengbu Sensor Valley undertaken by the company.

③ Intel Foundry Rumored to Secure Microsoft Maia Chip Contract on 18A or 18A-P Process

Media reports state Intel Foundry will manufacture Microsoft’s AI chip built on the 18A or 18A-P process node.

④ Synopsys Completes First LPDDR6 IP Silicon Verification on TSMC N2P Node

Synopsys announced its LPDDR6 memory interface IP has passed silicon bring-up on TSMC N2P process, marking a critical verification milestone for next-gen low-power mobile memory.

⑤ AMD Plans Silicon Photonics and AI R&D Centers in Tainan and Kaohsiung

According to tech media reports, AMD intends to build R&D hubs in Tainan and Kaohsiung focusing on silicon photonics, AI and heterogeneous integration. The investment is expected to drive industrial clustering of Taiwan’s silicon photonics sector.

⑥ Longsys Launches Industry-First Integrated Packaged mSSD

On October 20, Longsys released integrated packaged Micro SSD (mSSD). Restructuring the form factor of traditional SSD media, the new product delivers high quality, high efficiency, lower cost and greater flexibility to expand SSD commercial application scenarios.

⑦ TSMC Applies for A14 (1.4nm) Fab with Estimated Initial Investment of USD 49 Billion

TSMC has submitted construction application for the Central Taiwan Science Park A14 (1.4nm) fab. Mass production is scheduled for H2 2028 with initial investment estimated at USD 49 billion.

⑧ NVIDIA Rival Axelera Launches Europa Chip

On October 21, 2025, Axelera AI unveiled its new AIPU Europa in Eindhoven, the Netherlands. The chip targets multi-tenant generative AI and computer vision with new benchmarks for performance and cost.

⑨ UMC Rolls Out 55nm BCD Process Platform

On October 22, 2025, UMC officially launched its brand-new 55nm BCD process platform, representing key progress in power management semiconductor business.

⑩ Google Quantum Chip Hits Speed Breakthrough, 13,000x Faster Than Supercomputer

Google published research in Nature. Its 65-qubit superconducting processor Willow adopts the new Quantum Echoes algorithm and completes complex physical simulations roughly 13,000 times faster than Frontier, the world’s top supercomputer.

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