Weekly News Bulletin Sep 12, 2025
Weekly Semiconductor Industry News Brief
① Huaxin Microelectronics Builds China’s First 6-inch Compound Semiconductor Production Line
On September 4, Hitech announced via investor interactive platform that its subsidiary Zhuhai Huaxin Microelectronics has established China’s first commercial 6-inch compound semiconductor production line, marking a major breakthrough in domestic compound semiconductor industry.
② Intel Dalian Entity Renamed SK Hynix; Registered Capital Adjusted to RMB 358 Million
Enterprise database information shows Intel Semiconductor Storage Technology (Dalian) Co., Ltd. has changed its name to SK Hynix Semiconductor Storage Technology (Dalian) Co., Ltd.
③ Overview of CSEAC 2025 Forum on Semiconductor Equipment & Key Components
The 13th China Semiconductor Equipment and Core Components Exhibition (CSEAC 2025) kicked off on September 4 at Wuxi Taihu International Expo Center. The concurrent forum was hosted in morning and afternoon sessions by Yu Dayang and Cao Liansheng respectively.
④ TSMC Chiayi Phase II Project to Fuel Local Economic Growth
TSMC plans to deploy next-gen advanced packaging technologies at Chiayi Phase II plant. Southern Taiwan Science Park Administration has launched land preparation work, with the environmental impact assessment expected to start this week.
⑤ Espressif’s Private Placement Worth Nearly RMB 1.8 Billion Gets Approval
Shanghai Stock Exchange disclosed that Espressif Systems’ application for private A-share placement in 2025 has taken effect.
⑥ Silan Micro: Phase I of 8-inch SiC Project Completed, Trial Production Scheduled for Next Year
According to local media on September 5, the completion ceremony for Xiamen Silan Jihong 8-inch SiC power device production line (Phase I) was held in Haicang District.
⑦ China’s First 8-inch GaN-on-Si Micro-LED Pilot Line Put Through Operation
On the morning of September 8, Xingyao Semiconductor Micro-LED production line in Optics Valley went online, China’s first pilot line for 8-inch GaN-on-Si Micro-LED chips.
⑧ Infineon Unveils 12-inch SiC Wafer Technology
Infineon disclosed its 12-inch silicon carbide wafer technology. Meanwhile, three domestic companies also released updates on their 12-inch R&D progress.
⑨ Decowatt Releases World-First Millimeter-Wave Isolated Communication Technology
Shenzhen-based Decowatt launched the world’s first digital isolator chip adopting ultra-short-range millimeter-wave communication. It supports lossless transmission up to 5Gbps under over 10,000V isolation voltage, triggering a technological revolution in isolated communication.
⑩ Tesla Launches SiC Energy Storage System Using 400–800 MOSFETs
Tesla unveiled a new energy storage system at RE+ trade show in Las Vegas on September 9, featuring silicon carbide components as a key highlight.
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