Weekly News Bulletin Aug 15, 2025
Weekly Semiconductor Industry News Brief
① Hua Hong Semiconductor Releases Q2 2025 Financial Results with Doubled Profit
Hua Hong Semiconductor unveiled its Q2 2025 earnings report on August 7, delivering robust financial performance.
② Infineon, Wolfspeed and Others Announce Latest SiC Technology Advances
Multiple SiC players including Infineon, Wolfspeed, PineJET, Tyco Tianrun, Xinchangzheng, Founder Micro, Zhejiang University and National Innovation Center have rolled out innovative technological breakthroughs covering SiC JFET, trench superjunction and top-cooling packaging.
③ NVIDIA Secures U.S. Export License for H20 Chips to China While Market Concerns Remain
According to Financial Times on August 10, the U.S. Bureau of Industry and Security (BIS) granted NVIDIA a formal license to export H20 AI chips to China, allowing this China-customized chip to bypass export control restrictions. Nevertheless, doubts persist within the Chinese market.
④ Tianyue Advanced Launches Hong Kong IPO, Targeting Net Proceeds of About RMB 1.8 Billion
Tianyue Advanced published its global offering prospectus for H-shares on August 11, with trading slated to commence on the Hong Kong Stock Exchange on August 19.
⑤ ASMPT Restructures Business and Shutters Plant in Bao’an, Shenzhen
On August 11, semiconductor equipment giant ASMPT announced that on August 8, the shareholders of its indirect wholly-owned subsidiary Advanced Semiconductor Equipment (Shenzhen) Co., Ltd. (AEC) passed a resolution to set up a liquidation committee for voluntary winding-up of AEC.
⑥ Fearing Backdoor Risks, Chinese Automakers Accelerate Replacement of NVIDIA Chips
Nikkei Asia reported on the 6th that Chinese automakers and chip firms are speeding up development and adoption of domestic alternatives to replace automotive semiconductors from foreign giants such as NVIDIA, to hedge against tighter U.S. export curbs that may hinder domestic autonomous driving development.
⑦ Minxing Auto Obtains Patent for Double-Head Polishing Machine to Cut Equipment Footprint
According to China National Intellectual Property Administration data released August 12, Jiangsu Minxing Automotive Technology Co., Ltd. has been granted a patent for a double-head polishing machine (Publication No. CN223211116U), filed in September 2024.
⑧ SK Hynix Speeds Up 6-Layer EUV Process to Strive for Leadership in High-End Memory
SK Hynix pushes forward its 1c (6th-generation 10nm-class) DRAM technology and achieves large-scale integration of six-layer EUV lithography, emerging as one of the world’s leading vendors.
⑨ DuPont’s Polishing Pad Patent Fully Invalidated
China National Intellectual Property Administration ruled that all claims of DuPont’s patent titled “Polyurethane Polishing Pad” (Patent No. ZL201410448504.X), owned by DuPont Electronic Materials Holdings and its subsidiary DDP Specialty Electronic Materials US LLC, are invalid due to lack of inventiveness.
⑩ DEEPX Partners with Samsung to Develop World’s First 2nm Generative AI Chip, Mass Production in 2027
South Korean edge AI chip firm DEEPX announced on August 13 agreements with Samsung Electronics and Korean chip design service provider GAONCHIPS to jointly develop DX-M2, the world’s first 2nm edge generative AI chip.
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① https://www.dramx.com/News/made-sealing/20250808-38924.html
② https://mp.weixin.qq.com/s/2Pcmjl28U3-uDP04Tk-WYQ
③ https://www.eet-china.com/news/202508103591.html
④ https://mp.weixin.qq.com/s/FfwH_QfLgJVCVkxdQpkjwA
⑤ https://www.eet-china.com/news/202508112464.html
⑥ https://mp.weixin.qq.com/s/wbkG0Z87mkklC9_TMXQmMA
⑧ https://www.dramx.com/News/Memory/20250812-38941.html
⑨ https://mp.weixin.qq.com/s/X8H1lprzMY2vLreq8726Tw
⑩ https://www.dramx.com/News/AI/20250814-38951.html
