Weekly News Bulletin Aug 22, 2025

Weekly Semiconductor Industry News Brief

① Samsung to Build Chip Packaging R&D Center in Yokohama with USD 170 Million Investment

Samsung Electronics plans to set up an advanced chip packaging R&D center in Yokohama, Japan with an investment of 25 billion yen (approximately USD 170 million). The lab is expected to start operation in March 2027.

② Meixi Semiconductor Packaging Material Project to Be Delivered by Late August

The main plant of Meixi’s 20,000-ton annual output semiconductor packaging material project in Qingshi Economic Development Zone has been topped out. Customized equipment installation will follow. The project will be delivered at the end of August and put into production in November.

③ Hua Hong Semiconductor Plans Acquisition of Huali Micro to Target 200,000 12-inch Wafer Monthly Capacity

Leading specialty foundry Hua Hong Semiconductor announced plans to acquire controlling stake in sister company Shanghai Huali Microelectronics via share issuance and cash payment.

④ Official Confirmation: Konka Officially Integrated into China Resources Group

According to Xinhua News Agency on August 16, Konka was incorporated as a business unit under the technology and emerging industry division of China Resources Group at a special integration conference held in Shenzhen on August 15.

⑤ Huawei Investment Holding Boosts Registered Capital to RMB 63.886 Billion

Huawei Investment Holding completed industrial and commercial changes. Its registered capital rose by RMB 5.8 billion to roughly RMB 63.886 billion, nearly a 10% increase, which may strengthen its semiconductor layout.

⑥ New SiC Module Technology Enables 100,000-Hour Service Life for PCs

Automotive sector is the largest market for SiC modules. Nevertheless, strict automotive-grade certification standards bring tough reliability challenges for many SiC enterprises.

⑦ Tianyue Advanced Lists on Hong Kong Stock Exchange

On August 20, Shandong Tianyue Advanced Technology Co., Ltd. was officially listed on the main board of Hong Kong Stock Exchange, marking the launch of its A+H dual listing layout.

⑧ Sino-Microelectronics Proposes RMB 157 Million Acquisition of 56.24% Stake in Zhancheng Technology

On the evening of August 19, Sino-Microelectronics announced a plan to purchase a 56.24% equity interest in Qingdao Zhancheng Technology Co., Ltd. for RMB 157 million.

⑨ NVIDIA to Develop New China-Specific AI Chip B30A with Better Performance Than H20

Citing insiders, Reuters reported NVIDIA is developing B30A, a new AI chip tailored for China with higher performance than H20. Test samples are planned for Chinese customers as early as September 2025.

⑩ JCET Releases Interim Report with Revenue of RMB 18.61 Billion

On August 20, JCET unveiled its 2025 half-year financial report. It posted operating revenue of RMB 18.605 billion in H1 2025, a year-on-year increase of 20.14%.

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